Technical parameters/working voltage: 3.30 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MT48LC16M16A2TG-75
|
Micron | 完全替代 | TSOP |
DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54Pin TSOP-II
|
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