Technical parameters/forward voltage: 370 mV
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: DPAK
External dimensions/packaging: DPAK
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
STPS15L30CB-TR
|
ST Microelectronics | 功能相似 | TO-252-3 |
7.5 A 0.39 V 肖特基整流器 表面贴装 - TO-252-3
|
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