Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN55463JG
|
TI | 功能相似 | CDIP |
DUAL外设驱动程序 DUAL PERIPHERAL DRIVERS
|
||
SNJ55463JG
|
TI | 功能相似 | CDIP |
DUAL外设驱动程序 DUAL PERIPHERAL DRIVERS
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review