Technical parameters/Contact electroplating: Tin
Technical parameters/number of rows: 2
Technical parameters/number of pins: 12
Encapsulation parameters/installation method: Solder, PCB
Packaging parameters/pin spacing: 2.54 mm
External dimensions/pin spacing: 2.54 mm
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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