Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-92
External dimensions/packaging: TO-92
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC33064P-5
|
ON Semiconductor | 功能相似 | TO-226 |
UNDERVOLTAGE SENSING CIRCUIT
|
||
MC34064P-005
|
ON Semiconductor | 功能相似 | TO-92-3 |
欠压检测电路 UNDERVOLTAGE SENSING CIRCUIT
|
||
MC34064P-005G
|
ON Semiconductor | 功能相似 | TO-92 |
欠压检测电路 UNDERVOLTAGE SENSING CIRCUIT
|
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