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Description HV-100 Surface mounted sockets, vertical printed circuit board installation, top or bottom access, stackable terminals Housing material | LCP Black, UL 94V-0 rated ---|--- Contact material | Phosphor bronze Plating (contact zone) | 0.8μm gold over 1.3μm nickel Plating (solder zone) | 2.5μm tin over 1.3μm nickel ### 2.54mm TE Connectivity AMPMODU ™ Series - Model 2 (Europe) adopts a variety of modular interconnect systems with industrial standard 2.54mm (0.1 inch) grids, suitable for various industry applications. Designed for line to board or board to board connections, including stacking.
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Packaging
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
13.66  yuan 13.66yuan
5+:
$ 15.9787
50+:
$ 15.2958
200+:
$ 14.9134
500+:
$ 14.8178
1000+:
$ 14.7222
2500+:
$ 14.6130
5000+:
$ 14.5447
7500+:
$ 14.4764
Quantity
5+
50+
200+
500+
1000+
Price
$15.9787
$15.2958
$14.9134
$14.8178
$14.7222
Price $ 15.9787 $ 15.2958 $ 14.9134 $ 14.8178 $ 14.7222
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(5208) Minimum order quantity(5)
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Technical parameters/number of contacts: 8

Technical parameters/polarity: Female

Technical parameters/Contact electroplating: Gold

Technical parameters/rated voltage (AC): 250 V

Technical parameters/rated current: 3 A

Technical parameters/number of rows: 1

Technical parameters/direction: Vertical

Technical parameters/Flammability level: UL 94 V-0

Technical parameters/number of pins: 8

Technical parameters/rated current (Max): 3A/contact

Technical parameters/rated voltage (Max): 250 VAC

Technical parameters/rated voltage: 250 VAC

Technical parameters/Contact resistance (Max): 12 MΩ

Encapsulation parameters/installation method: Surface Mount

Packaging parameters/pin spacing: 2.54 mm

External dimensions/height: 6.2 mm

External dimensions/pin spacing: 2.54 mm

Physical parameters/color: Black

Physical parameters/contact material: Phosphor Bronze

Physical parameters/operating temperature: -65℃ ~ 125℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Other/Manufacturing Applications: -, industry

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/ELV standards: Compliant

Compliant with standards/REACH SVHC standards: No SVHC

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
1241152-8 1241152-8 Tyco Electronics 类似代替 Surface Mount
HV-100 表面安装插座 垂直印刷电路板安装 顶部或底部接入 可堆叠终端 Housing material | LCP Black, UL 94V-0 rated ---|--- Contact material | Phosphor bronze Plating (contact zone) | 0.8μm gold over 1.3μm nickel Plating (solder zone) | 2.5μm tin over 1.3μm nickel ### 2.54mm TE Connectivity AMPMODU™ 系列 – 型号 2(欧洲) 采用工业标准 2.54 毫米(0.1 英寸)栅格的多种类模块化互连系统,适合各个行业应用。 设计用于线到板或板到板连接,包括堆叠。
PDF
1241152-8 1241152-8 TE Connectivity 类似代替
HV-100 表面安装插座 垂直印刷电路板安装 顶部或底部接入 可堆叠终端 Housing material | LCP Black, UL 94V-0 rated ---|--- Contact material | Phosphor bronze Plating (contact zone) | 0.8μm gold over 1.3μm nickel Plating (solder zone) | 2.5μm tin over 1.3μm nickel ### 2.54mm TE Connectivity AMPMODU™ 系列 – 型号 2(欧洲) 采用工业标准 2.54 毫米(0.1 英寸)栅格的多种类模块化互连系统,适合各个行业应用。 设计用于线到板或板到板连接,包括堆叠。
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