Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SCAN921226HSM
|
TI | 功能相似 | BGA-49 |
具有 IEEE 1149.1 测试访问的高温 20MHz - 80MHz 10 位解串器 49-NFBGA -40 to 125
|
||
SCAN921226HSM
|
National Semiconductor | 功能相似 | FBGA |
具有 IEEE 1149.1 测试访问的高温 20MHz - 80MHz 10 位解串器 49-NFBGA -40 to 125
|
||
SCAN921226HSM/NOPB
|
TI | 完全替代 | FBGA-49 |
串行器/解串器 - Serdes High Tem 20MHz-80 MHz 10B Serializer
|
||
SCAN921226HSMX/NOPB
|
TI | 类似代替 | LFBGA-49 |
High Temperature 20MHz - 80MHz 10Bit Deserializer with IEEE 1149.1 Test Access 49-NFBGA -40℃ to 125℃
|
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