Technical parameters/Contact electroplating: Silver
Technical parameters/rated voltage (DC): 24 V
Technical parameters/rated voltage (AC): 125 V
Technical parameters/rated current: 3A (AC), 2A (DC)
Technical parameters/insulation resistance: 1.00 GΩ
Technical parameters/direction: Vertical
Technical parameters/contact type: SPST-NO
Technical parameters/Contact resistance: 10.0 mΩ
Technical parameters/Contact rated current: 2.00 A
Encapsulation parameters/installation method: Panel, Solder Lug
Encapsulation parameters/Encapsulation: -
External dimensions/length: 17 mm
External dimensions/width: 14 mm
External dimensions/height: 39.2 mm
External dimensions/packaging: -
Physical parameters/color: Black
Physical parameters/contact material: Copper
Physical parameters/operating temperature: -20℃ ~ 55℃
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Industrial, Industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2016/06/20
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