Encapsulation parameters/Encapsulation: -
External dimensions/packaging: -
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Automotive grade, Boardflex sensitive
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
C3216X7R2A104K160AM
|
TDK | 类似代替 | 1206 |
C 系列 1206 0.1 uF 100 V ±10% 容差 X7R 表面贴装 多层陶瓷电容
|
||
HMK316B7104KL-T
|
Taiyo Yuden | 类似代替 | 1206 |
材质:X7R
|
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