Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Not Recommended
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BQ4830YMA-85
|
TI | 功能相似 | DIP-28 |
RTC模块32Kx8 NVSRAM RTC Module With 32Kx8 NVSRAM
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||
M48T35Y-70PC1
|
ST Microelectronics | 功能相似 | DIP-28 |
STMICROELECTRONICS M48T35Y-70PC1 芯片, SRAM, TIMEKEEPER? 256K
|
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