Technical parameters/number of pins: 400
Technical parameters/RAM size: 256 KB
Package parameters/number of pins: 400
Encapsulation parameters/Encapsulation: LFBGA-400
External dimensions/packaging: LFBGA-400
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7Z020-2CLG400I
|
Xilinx | 完全替代 | CSPBGA-400 |
XC7Z020-2CLG400I 磨码
|
||
XC7Z020-2CLG400I
|
Xilinx | 完全替代 | CSPBGA-400 |
XC7Z020-2CLG400I 磨码
|
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