Technical parameters/number of contacts: 20
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 3 A
Technical parameters/number of rows: 2
Technical parameters/number of pins: 20
Technical parameters/number of plug and unplug cycles: 100
Technical parameters/installation angle: 180 °
Technical parameters/rated current (Max): 3 A
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/rated voltage: 150VDC, 100VAC
Technical parameters/Contact resistance (Max): 10 mΩ
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: DIP
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 25.4 mm
External dimensions/width: 10.16 mm
External dimensions/height: 2.41 mm
External dimensions/packaging: DIP
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
115-43-320-41-001000
|
Mill-Max | 类似代替 |
MILL MAX 115-43-320-41-001000 芯片插座, DIP, 16路
|
|||
115-43-320-41-003000
|
Mill-Max | 类似代替 | DIP |
MILL MAX 115-43-320-41-003000 芯片插座, DIP-20, 通孔安装
|
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