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Model 66AK2H14AAAW24
Description Multi core DSPARM KeyStone II System on Chip (SoC)
Product QR code
Brand: TI
Packaging FCBGA-1517
Delivery time
Packaging method Tray
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(5876) Minimum order quantity(1)
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Technical parameters/RAM size: 6144 KB

Technical parameters/number of ART: 2

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): 0 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 1517

Encapsulation parameters/Encapsulation: FCBGA-1517

External dimensions/length: 40 mm

External dimensions/width: 40 mm

External dimensions/height: 3.75 mm

External dimensions/packaging: FCBGA-1517

Physical parameters/operating temperature: 0℃ ~ 85℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Customs information/ECCN code: 5A002

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
66AK2H14AAAW24 66AK2H14AAAW24 TI 完全替代 FCBGA-1517
多核DSPARM的KeyStone II系统级芯片（SoC ） Multicore DSPARM KeyStone II System-on-Chip (SoC)

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