Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Solder
External dimensions/length: 10.5 mm
External dimensions/height: 7.01 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Physical parameters/shell material: Brass
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standards/military grade: Yes
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
73415-1121
|
Molex | 类似代替 |
MOLEX 73415-1121 射频/同轴连接器, MMCX同轴, 直角插头, 压接, 50 ohm, RG316, 黄铜
|
|||
908-43300
|
Amphenol | 类似代替 | 908 |
AMPHENOL RF 908-43300 射频/同轴连接器, MMCX同轴, 直角插头, 焊接, 50 ohm, RG188A/U, RG174/U, 黄铜
|
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