Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
100314DC
|
Fairchild | 功能相似 | SOIC-24 |
LINE RECEIVER, CDIP24, 0.400 INCH, CERAMIC, DIP-24
|
||
|
|
TI | 功能相似 | DIP |
LINE RECEIVER
|
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