Encapsulation parameters/installation method: Surface Mount
Physical parameters/medium materials: Tantalum
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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ON Semiconductor | 类似代替 |
PANASONIC ELECTRONIC COMPONENTS 10TPB330M 表面贴装钽电容, TPB系列, 330 µF, 2917 [7343 公制], 0.035 ohm, 10 V
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T520X337M010ATE025
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KEMET Corporation | 功能相似 | 2917 |
KEMET T520X337M010ATE025 表面贴装钽电容, T520系列, 330 µF, 2917 [7343 公制], 0.025 ohm, 10 V
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T543X337M010AHW025
|
KEMET Corporation | 类似代替 | 2917 |
KEMET T543X337M010AHW025 表面贴装钽电容, T543系列, 330 µF, 2917 [7343 公制], 0.025 ohm, 10 V
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