Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 5 GΩ
Technical parameters/Contact resistance: 3 mΩ
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Beryllium Copper
Physical parameters/medium materials: Tetrafluoroethylene (TFE)
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Contains Lead
Compliant with standards/ELV standards: Non-Compliant
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