Technical parameters/Contact electroplating: Silver
Technical parameters/Contact resistance: 1.50 mΩ
Physical parameters/contact material: Brass
Physical parameters/materials: Brass
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standards/military grade: Yes
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
13-06-1 TSS RG58U
|
Multicomp | 完全替代 |
MULTICOMP 13-06-1 TSS RG58U 射频/同轴连接器, BNC同轴, 直角插头, 焊接, 50 ohm, RG58, 黄铜
|
|||
13-55-1 TSS RG174U
|
Multicomp | 完全替代 |
MULTICOMP 13-55-1 TSS RG174U 射频/同轴连接器, BNC同轴, 直型插头, 压接, 50 ohm, RG174, 黄铜
|
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