Technical parameters/frequency: 50 MHz
Technical parameters/power supply voltage (DC): 1.80V (min)
Technical parameters/clock frequency: 50.0 MHz
Technical parameters/RAM size: 4K x 8
Technical parameters/digits: 32
Technical parameters/dissipated power: 1500 mW
Technical parameters/FLASH memory capacity: 8 kB
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 1500 mW
Technical parameters/power supply voltage: 1.8V ~ 3.6V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 1.8 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 33
Encapsulation parameters/Encapsulation: HVQFN-32
External dimensions/length: 7.1 mm
External dimensions/width: 7.1 mm
External dimensions/height: 0.95 mm
External dimensions/packaging: HVQFN-32
Physical parameters/weight: 132.43131437999998 mg
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LPC1111FHN33/202,5
|
NXP | 类似代替 | HVQFN-33 |
ARM Cortex-M0 微控制器，NXP 基于 ARM Cortex-M0 的 NXP 系列低成本 32 位 MCU 设计用于 8/16 位微控制器应用程序。 与 8/16 位架构相比，它们提供了高性能、低功耗、简单指令集和存储寻址且减小了代码长度。 借助 16 位封装实现 32 位性能，可获得更高的电源效率和更长的电池寿命 小尺寸使处理器和模拟电路能够在单模上实施 超低功耗和集成睡眠模式，带来更长的电池寿命 Thumb® 指令集，可实现编码密度最大化 ### ARM Cortex 微控制器，NXP
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