Technical parameters/number of contacts: 14
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 3 A
Technical parameters/number of rows: 2
Technical parameters/installation angle: 180 °
Technical parameters/rated current (Max): 3A/contact
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: Open Frame
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 17.8 mm
External dimensions/width: 10.2 mm
External dimensions/height: 2.41 mm
External dimensions/packaging: Open Frame
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Industrial, Industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
514-AG10D
|
Buchanan | 功能相似 |
AMP FROM TE CONNECTIVITY 514-AG10D 芯片插座, DIP, 触点数:14
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review