Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 12.7 mm
External dimensions/height: 16.55 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/medium materials: Tetrafluoroethylene (TFE)
Other/Product Lifecycle: Active
Other/Packaging Methods: Carton
Other/Manufacturing Applications: Signal, Power
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536694010
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