Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-40
External dimensions/packaging: DIP-40
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Communication and Networking, Automation&Process Control, Building Automation, Communications&Networking, Motor Drive&Control, Automotive, Building Automation, Lighting, Consumer Electronics, Industrial, Portable Equipment, Automotive, Lighting, Portable Devices, Automation and Process Control, Sensing and Instrumentation, Industrial, Consumer Electronics, Motor Drive and Control, Sensing&Instrumentation
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/06/15
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