Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG508ADJ+
|
Maxim Integrated | 功能相似 | DIP-16 |
MAXIM INTEGRATED PRODUCTS DG508ADJ+ 芯片, 模拟多路复用器, 单路, 8:1, DIP-16
|
||
HI3-0509A-5Z
|
Intersil | 功能相似 | DIP-16 |
INTERSIL HI3-0509A-5Z 芯片, 多路复用器, CMOS
|
||
HI3-0509A-5Z
|
Renesas Electronics | 功能相似 | DIP-16 |
INTERSIL HI3-0509A-5Z 芯片, 多路复用器, CMOS
|
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