Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 5.00 GΩ
Encapsulation parameters/installation method: Panel
Physical parameters/contact material: Beryllium Copper
Physical parameters/medium materials: Tetrafluoroethylene (TFE)
Physical parameters/operating temperature: -65℃ ~ 125℃
Other/Product Lifecycle: Superseded
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
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