Technical parameters/number of contacts: 55
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 1.5 A
Technical parameters/number of rows: 5
Technical parameters/number of pins: 55
Technical parameters/rated current (Max): 1.5A/contact
Technical parameters/rated voltage: 500 V
Technical parameters/Contact resistance (Max): 20 mΩ
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.00 mm
External dimensions/width: 20.3 mm
External dimensions/height: 12.25 mm
External dimensions/pin spacing: 2.00 mm
Physical parameters/contact material: Phosphor Bronze
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5100161-1
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TE Connectivity | 功能相似 | - |
TE Connectivity Z-PACK™ HM 2mm C 型背板连接器 Z-PACK™ HM 2mm C 型背板直角和垂直安装管座和插座连接器,用于 2mm HM 接口,提供自由或固定板印刷电路板安装,带接地复位屏蔽选项、操作引脚柱触点和 CompactPCI 选项,有关详细信息,请参见附加数据表。 这些 Z-PACK™ 硬公制 C 型背板连接器,具有 UL 94V-0 聚酯外壳,带各种配接对准选项,包括导向片和极化销,并提供标准串扰。 ### TE Connectivity AMP Z-PACK™ 系列 Z-PACK 2 mm HM 互连系统设计为两件式系统,用于自由板(子板或印刷电路板)和固定板(主板、背板或后面板)的连接,以及通过固定板馈通连接。
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Amphenol ICC | 完全替代 |
硬公制连接器 RECPT 55P TYPE C R/A W/FIXING PEGS
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