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Model 840-AG11D-ES
Description TE Connectivity Printed Circuit Board DIP Socket - Economy 800 Series Economy 800 Series Printed Circuit Board DIP Socket features an open trapezoidal frame style and a 2.54mm centerline. These printed circuit board DIP IC sockets can be installed vertically and embossed with four finger paired gold-plated contacts. Precision four finger internal contacts provide concentric funnel-shaped entry ports for flat and circular leads to be inserted into X and Y stackable open ladders for easy cooling, cleaning, and inspection. Thin design allows for rectangular or circular IC leads without capillary action. The bottom enclosed sleeve provides 100% anti flux and solder contamination protection and has been certified by Underwriters Laboratories component program (file number E111362). Beryllium copper internal contacts achieve the highest mechanical and electrical performance. # # # IC socket - DIL molded pins
Product QR code
Brand: TE Connectivity
Packaging
Delivery time
Packaging method Tube
Standard packaging quantity 1
29.73  yuan 29.73yuan
5+:
$ 34.7853
50+:
$ 33.2987
200+:
$ 32.4663
500+:
$ 32.2581
1000+:
$ 32.0500
2500+:
$ 31.8122
5000+:
$ 31.6635
7500+:
$ 31.5149
Quantity
5+
50+
200+
500+
1000+
Price
$34.7853
$33.2987
$32.4663
$32.2581
$32.0500
Price $ 34.7853 $ 33.2987 $ 32.4663 $ 32.2581 $ 32.0500
Start batch production 5+ 50+ 200+ 500+ 1000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(3593) Minimum order quantity(5)
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Technical parameters/number of contacts: 40

Technical parameters/Contact electroplating: Gold, Tin Lead

Technical parameters/rated current: 3 A

Technical parameters/insulation resistance: 5.00 GΩ

Technical parameters/number of rows: 2

Technical parameters/number of pins: 40

Technical parameters/Contact resistance: 10 mΩ

Technical parameters/rated current (Max): 3A/contact

Technical parameters/operating temperature (Max): 105 ℃

Technical parameters/operating temperature (Min): -55 ℃

Technical parameters/Contact resistance (Max): 10 mΩ

Encapsulation parameters/installation method: Through Hole

Packaging parameters/pin spacing: 2.54 mm

External dimensions/length: 50.8 mm

External dimensions/width: 17.78 mm

External dimensions/height: 4.57 mm

External dimensions/pin spacing: 2.54 mm

Physical parameters/contact material: Beryllium Copper

Physical parameters/operating temperature: -55℃ ~ 105℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tube

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

Compliant with standards/ELV standards: Compliant

Customs information/ECCN code: EAR99

Customs information/HTS code: 8536694040

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