Technical parameters/power supply voltage (DC): 1.65V (min)
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX3012EUP+
|
Maxim Integrated | 完全替代 | TSSOP-20 |
MAXIM INTEGRATED PRODUCTS MAX3012EUP+ 芯片, 逻辑转换器
|
||
MAX3012EUP-T
|
Maxim Integrated | 功能相似 | TSSOP |
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1μA, 35Mbps, 8Channel Level Translators
|
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