Technical parameters/RAM size: 0 b
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.71V ~ 3.465V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FTBGA-256
External dimensions/length: 17 mm
External dimensions/width: 17 mm
External dimensions/height: 1.25 mm
External dimensions/packaging: FTBGA-256
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LCMXO640C-3BN256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
FPGA - 现场可编程门阵列 640 LUTs 159 I/O 1.8/2.5/3.3V -3 SPD
|
||
LCMXO640C-3FTN256C
|
Lattice Semiconductor | 完全替代 | LBGA-256 |
CPLD MachXO Family 320 Macro Cells 1.8V/2.5V/3.3V 256Pin FTBGA Tray
|
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