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Model 2-1571552-2
Description TE Connectivity Printed Circuit Board DIP Socket - Economy 800 Series Economy 800 Series Printed Circuit Board DIP Socket features an open trapezoidal frame style and a 2.54mm centerline. These printed circuit board DIP IC sockets can be installed vertically and embossed with four finger paired gold-plated contacts. Precision four finger internal contacts provide concentric funnel-shaped entry ports for flat and circular leads to be inserted into X and Y stackable open ladders for easy cooling, cleaning, and inspection. Thin design allows for rectangular or circular IC leads without capillary action. The bottom enclosed sleeve provides 100% anti flux and solder contamination protection and has been certified by Underwriters Laboratories component program (file number E111362). Beryllium copper internal contacts achieve the highest mechanical and electrical performance. # # # IC socket - DIL molded pins
Product QR code
Brand: TE Connectivity
Packaging -
Delivery time
Packaging method Tube
Standard packaging quantity 1
3.42  yuan 3.42yuan
5+:
$ 4.6197
25+:
$ 4.2775
50+:
$ 4.0380
100+:
$ 3.9353
500+:
$ 3.8669
2500+:
$ 3.7813
5000+:
$ 3.7471
10000+:
$ 3.6958
Quantity
5+
25+
50+
100+
500+
Price
$4.6197
$4.2775
$4.0380
$3.9353
$3.8669
Price $ 4.6197 $ 4.2775 $ 4.0380 $ 3.9353 $ 3.8669
Start batch production 5+ 25+ 50+ 100+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(4233) Minimum order quantity(5)
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Technical parameters/number of contacts: 8

Technical parameters/polarity: Female

Technical parameters/Contact electroplating: Gold, Tin

Technical parameters/rated current: 3 A

Technical parameters/insulation resistance: 5000 MΩ

Technical parameters/capacitors: 1.00 pF

Technical parameters/number of rows: 2

Technical parameters/Flammability level: UL 94 V-0

Technical parameters/number of pins: 8

Technical parameters/Contact resistance: 10.0 mΩ

Technical parameters/rated current (Max): 3A/contact

Technical parameters/operating temperature (Max): 125 ℃

Technical parameters/operating temperature (Min): -55 ℃

Technical parameters/Contact resistance (Max): 10 mΩ

Encapsulation parameters/installation method: Through Hole

Package parameters/number of pins: 8

Encapsulation parameters/Encapsulation: -

Packaging parameters/pin spacing: 2.54 mm

External dimensions/length: 10.16 mm

External dimensions/width: 4.57 mm

External dimensions/height: 4.57 mm

External dimensions/packaging: -

External dimensions/pin spacing: 2.54 mm

Physical parameters/color: Black

Physical parameters/contact material: Beryllium Copper

Physical parameters/operating temperature: -55℃ ~ 105℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tube

Other/Manufacturing Applications: Signal

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/ELV standards: Compliant

Compliant with standards/REACH SVHC standards: No SVHC

Customs information/ECCN code: EAR99

Customs information/HTS code: 8536694040

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
1-390261-2 1-390261-2 TE Connectivity 类似代替 DIP
AMP FROM TE CONNECTIVITY 1-390261-2 芯片和元件插座, DIP插座, 8 触点, 2.54 mm, 7.62 mm, 镀锡触芯
PDF
2-640463-4 2-640463-4 TE Connectivity 类似代替
Conn DIP Socket SKT 8POS 2.54mm Solder ST Thru-Hole Tube
PDF

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