Technical parameters/Contact electroplating: Silver
Technical parameters/installation angle: 90.0 °
Encapsulation parameters/installation method: Solder
External dimensions/length: 27 mm
External dimensions/width: 14.3 mm
External dimensions/height: 25.8 mm
Physical parameters/contact material: Beryllium Copper
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536694050
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
31-9-75
|
Amphenol | 功能相似 |
AMPHENOL RF 31-9-75 射频/同轴连接器, BNC, 直角转接头, 公-母
|
|||
31-9-RFX
|
Amphenol | 功能相似 |
AMPHENOL RF 31-9-RFX 射频/同轴适配器, 同轴混合系列, 直角转接器, BNC, 插座, BNC, 插头
|
|||
73151-5001
|
Molex | 类似代替 |
MOLEX 73151-5001 射频/同轴适配器, 同轴混合系列, 直角转接器, BNC, 插头, BNC, 插座
|
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