Technical parameters/number of contacts: 16
Technical parameters/polarity: Female
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 1 A
Technical parameters/insulation resistance: 1 TΩ
Technical parameters/number of rows: 2
Technical parameters/number of pins: 16
Technical parameters/installation angle: 180 °
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
Packaging parameters/pin spacing: 7.62 mm
External dimensions/length: 40.4 mm
External dimensions/width: 14.5 mm
External dimensions/height: 16.3 mm
External dimensions/packaging: SOIC
External dimensions/pin spacing: 7.62 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 150℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Industrial, Industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
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