Technical parameters/Contact electroplating: Silver
Technical parameters/Contact resistance: 1.50 mΩ
Encapsulation parameters/installation method: Panel
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards: Exempt
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standards/military grade: Yes
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
031-105
|
Amphenol | 类似代替 |
射频/同轴, BNC 连接器, 公, 直型, 50 Ω,
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review