Technical parameters/number of contacts: 6
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 1.00 A
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
506-AG10D
|
TE Connectivity | 功能相似 |
AMP FROM TE CONNECTIVITY 506-AG10D 芯片插座, DIP, 针长:0.125""
|
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506-AG10D
|
Buchanan | 功能相似 |
AMP FROM TE CONNECTIVITY 506-AG10D 芯片插座, DIP, 针长:0.125""
|
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