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Model TPS61253YFFT
Description Step-Up (Boost) DC/DC Converters (Integrated Switch), Texas Instruments ### DC/DC Switching Regulator Converter (Integrated Switch), Texas Instruments' highly integrated high-efficiency switching regulator series includes step-up (boost), step-down (buck), step-up/step-down (boost/buck), and inverter types, providing efficient solutions for every DC voltage stabilizer application.
Product QR code
Brand: TI
Packaging UFBGA-9
Delivery time
Packaging method Cut Tape (CT)
Standard packaging quantity 1
3.47  yuan 3.47yuan
5+:
$ 4.6778
25+:
$ 4.3313
50+:
$ 4.0887
100+:
$ 3.9848
500+:
$ 3.9155
2500+:
$ 3.8288
5000+:
$ 3.7942
10000+:
$ 3.7422
Quantity
5+
25+
50+
100+
500+
Price
$4.6778
$4.3313
$4.0887
$3.9848
$3.9155
Price $ 4.6778 $ 4.3313 $ 4.0887 $ 3.9848 $ 3.9155
Start batch production 5+ 25+ 50+ 100+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(4235) Minimum order quantity(5)
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Technical parameters/number of output interfaces: 1

Technical parameters/output voltage: 5 V

Technical parameters/output current: 1.5 A

Technical parameters/number of pins: 9

Technical parameters/Static current: 20.0 µA

Technical parameters/adjusted output number: 1

Technical parameters/switching frequency: 3.5 MHz

Technical parameters/topology structure: Boost

Technical parameters/switch current: 3.6 A

Technical parameters/input voltage (Max): 4.85 V

Technical parameters/input voltage (Min): 2.65 V

Technical parameters/output voltage (Max): 5 V

Technical parameters/output voltage (Min): 5 V

Technical parameters/output current (Max): 3.3 A

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Technical parameters/input voltage: 3.3V ~ 4.85V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 9

Encapsulation parameters/Encapsulation: UFBGA-9

External dimensions/length: 1.26 mm

External dimensions/width: 1.356 mm

External dimensions/height: 0.325 mm

External dimensions/packaging: UFBGA-9

Physical parameters/operating temperature: -40℃ ~ 85℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Cut Tape (CT)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/REACH SVHC standards: No SVHC

Compliant with standard/REACH SVHC version: 2015/06/15

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
TPS61256YFFR TPS61256YFFR TI 类似代替 DSBGA-9
3.5 MHz的高效率，升压型转换器，芯片级封装 3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING

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