Technical parameters/number of contacts: 24
Technical parameters/Contact electroplating: Tin
Technical parameters/rated current: 3 A
Technical parameters/number of rows: 2
Technical parameters/number of pins: 24
Technical parameters/number of plug and unplug cycles: 1000
Technical parameters/installation angle: 180 °
Technical parameters/rated current (Max): 3 A
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/rated voltage: 150VDC, 100VAC
Technical parameters/Contact resistance (Max): 10 mΩ
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: DIP-24
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 30.4 mm
External dimensions/width: 10.16 mm
External dimensions/height: 4.19 mm
External dimensions/packaging: DIP-24
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2227MC-24-03-06-F1
|
Multicomp | 类似代替 |
MULTICOMP 2227MC-24-03-06-F1 芯片和元件插座, 2227MC系列, DIP插座, 24 触点, 2.54 mm, 7.62 mm, 镀锡触芯
|
|||
2227MC-24-06-08-F1
|
Multicomp | 类似代替 |
MULTICOMP 2227MC-24-06-08-F1 芯片和元件插座, 2227MC系列, DIP, 24 触点, 2.54 mm, 15.24 mm, 镀锡触芯
|
|||
SPC15503
|
Multicomp | 类似代替 |
MULTICOMP SPC15503 芯片插座, DIP, 触点数:24, 排距:0.3""
|
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