Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: .5 A
Technical parameters/rated current (Max): 0.5 A
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: -
External dimensions/length: 1.00 mm
External dimensions/width: 1 mm
External dimensions/height: 2.7 mm
External dimensions/packaging: -
External dimensions/thickness: 3 mm
Physical parameters/contact material: Copper Alloy
Physical parameters/materials: Copper Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Portable equipment, multimedia, lighting, industrial, medical, Signal, communication and networking, consumer electronics, IoT (Internet of Things), automotive, smartphone
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
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