Technical parameters/number of pins: 676
Technical parameters/RAM size: 256 KB
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: BBGA-676
External dimensions/packaging: BBGA-676
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7Z045-1FBG676C
|
Xilinx | 完全替代 | FCBGA-676 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,667 MHz, FCBGA-676
|
||
XC7Z045-1FBG676I
|
Xilinx | 完全替代 | BBGA-676 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,667 MHz, FCBGA-676
|
||
XC7Z045-2FBG676I
|
Xilinx | 完全替代 | FCBGA-676 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,800 MHz, FCBGA-676
|
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