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Description Board to board and sandwich connectors 20 50/50 GRID DRST VERT DUAL ROW
Product QR code
Packaging
Delivery time
Packaging method Tube
Standard packaging quantity 1
18.55  yuan 18.55yuan
5+:
$ 21.7023
50+:
$ 20.7749
200+:
$ 20.2555
500+:
$ 20.1257
1000+:
$ 19.9958
2500+:
$ 19.8474
5000+:
$ 19.7547
7500+:
$ 19.6619
Quantity
5+
50+
200+
500+
1000+
Price
$21.7023
$20.7749
$20.2555
$20.1257
$19.9958
Price $ 21.7023 $ 20.7749 $ 20.2555 $ 20.1257 $ 19.9958
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(9662) Minimum order quantity(5)
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Technical parameters/number of contacts: 20

Technical parameters/Contact electroplating: Tin Lead, Gold

Technical parameters/insulation resistance: 5000 MΩ

Technical parameters/number of rows: 2

Technical parameters/direction: Vertical

Technical parameters/Flammability level: UL 94 V-0

Technical parameters/number of pins: 20

Technical parameters/rated current (Max): 4A/contact

Technical parameters/operating temperature (Max): 105 ℃

Technical parameters/operating temperature (Min): -65 ℃

Technical parameters/rated voltage (Max): 30 VAC

Technical parameters/Contact resistance (Max): 16 mΩ

Encapsulation parameters/installation method: Surface Mount

Packaging parameters/pin spacing: 1.27 mm

External dimensions/length: 13.1 mm

External dimensions/width: 3.05 mm

External dimensions/height: 4.83 mm

External dimensions/pin spacing: 1.27 mm

Physical parameters/shell color: Black

Physical parameters/color: Black

Physical parameters/contact material: Copper Alloy

Physical parameters/operating temperature: -65℃ ~ 105℃

Physical parameters/shell material: Thermoplastic

Other/Product Lifecycle: Active

Other/Packaging Methods: Tube

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

Compliant with standards/ELV standards: Non-Compliant

Customs information/ECCN code: EAR99

Customs information/HTS code: 8536694040

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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