Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Solder
Physical parameters/contact material: Beryllium Copper
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
19-58W-5-TGG
|
Multicomp | 类似代替 |
MULTICOMP 19-58W-5-TGG 射频/同轴连接器, SMA同轴, 直型隔板安装插座, 焊接, 50 ohm, RG402, 铍铜
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review