Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SST38VF6402-90-5C-B3KE
|
Microchip | 功能相似 | TFBGA |
SST38VF系列 64Mb4 Mx16 3.3V 高级多功能闪存(MPF+)-TFBGA-48
|
||
SST38VF6404-90-5C-B3KE
|
Microchip | 功能相似 | BGA-48 |
MICROCHIP SST38VF6404-90-5C-B3KE 芯片, 闪存, 64M, MPF, 48TFBGA
|
||
SST38VF6404-90-5I-B3KE
|
Microchip | 功能相似 | TFBGA-48 |
SST38VF 系列 64 Mb (4 M x 16) 3.3 V 闪存 - TFBGA-48
|
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