Encapsulation parameters/Encapsulation: TSOP-2
External dimensions/packaging: TSOP-2
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS71116AGP-8I
|
GSI | 功能相似 | TSOP-2 |
SRAM Chip Async Single 3.3V 1M-Bit 64K x 16 8ns 44Pin TSOP-II
|
||
K6R1016V1D-TI08
|
Samsung | 功能相似 | TSOP-2 |
64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
|
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