Technical parameters/RAM size: 256 B
Technical parameters/I/O pin count: 22
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/dissipated power (Max): 500 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 36
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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ST Microelectronics | 类似代替 | LFBGA |
8位MCU的Flash或ROM存储器, ADC ,两个16位定时器, I2C , SPI , SCI INTERFACES 8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES
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