Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: MSOP
External dimensions/packaging: MSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BR93L46FV-W
|
ROHM Semiconductor | 功能相似 | SSOP |
与Microwire总线的1K位( 64× 16位) EEPROM Microwire BUS 1Kbit(64 x 16bit) EEPROM
|
||
BR93L46RFV-W
|
ROHM Semiconductor | 功能相似 | SSOP |
与Microwire总线的1K位( 64× 16位) EEPROM Microwire BUS 1Kbit(64 x 16bit) EEPROM
|
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