Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Integrated Device Technology | 功能相似 | DIP |
快速CMOS八路双向收发器 FAST CMOS OCTAL BIDIRECTIONAL TRANSCEIVERS
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