Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM27S19DMB
|
AMD | 功能相似 | DIP |
Memory Circuit, 32X8, Bipolar, CDIP16, CERAMIC, DIP-16
|
||
JBP18S030MJ
|
TI | 类似代替 | CDIP |
256位( 32个字由8位)可编程只读存储器 256 BITS (32 WORDS BY 8 BITS) PROGRAMMABLE READ-ONLY MEMORIES
|
||
N82S123N
|
Philips | 功能相似 | DIP |
256Bit TTL bipolar PROM 32 x 8
|
||
N82S123N
|
NXP | 功能相似 | DIP |
256Bit TTL bipolar PROM 32 x 8
|
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