Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Cypress Semiconductor | 功能相似 | DIP |
OTP ROM, 512X8, 40ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24
|
||
962885-1
|
TE Connectivity | 功能相似 | - |
OTP ROM, 512X8, 40ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24
|
||
962885-1
|
Tyco Electronics | 功能相似 |
OTP ROM, 512X8, 40ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24
|
|||
CY7C225A-25PC
|
Cypress Semiconductor | 功能相似 | PDIP |
512 ×8 PROM注册 512 x 8 Registered PROM
|
||
HM1-6642B/883
|
Renesas Electronics | 功能相似 | DIP |
PROM Parallel 4Kbit 5V 24Pin SBCDIP
|
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