Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-8
External dimensions/packaging: TSSOP-8
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AT24C64D-XHM-B
|
ATMEL | 功能相似 | TSSOP-8 |
EEPROM, 串行I2C (2-线), 64 Kbit, 8K x 8位, 1 MHz, TSSOP, 8 引脚
|
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