Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XCV300E-6FG256C
|
Xilinx | 功能相似 | BGA-256 |
FPGA Virtex-E Family 82.944K Gates 6912 Cells 357MHz 0.18um Technology 1.8V 256Pin FBGA
|
||
XCV300E-6FG256I
|
Xilinx | 功能相似 | BGA-256 |
FPGA Virtex-E Family 82.944K Gates 6912 Cells 357MHz 0.18um Technology 1.8V 256Pin FBGA
|
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