Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TQFP-64
External dimensions/packaging: TQFP-64
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LAN83C185-JT
|
SMC | 功能相似 | TQFP |
IC PHY 10/100 3.3V LP 64-TQFP
|
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