Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Semtech Corporation | 功能相似 | TSSOP |
High Speed Synchronous Power MOSFET Smart Driver
|
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|
Semtech Corporation | 功能相似 | TSSOP |
HIGH SPEED SYNCHRONOUS POWER MOSFET SMART DRIVER
|
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